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来源:LM317 Electronics Components编辑:HALO时间:2021-06-15 14:35:14

Infineon would join Freescale Semiconductor, an un-named North Californian chipmaker, and the Korea Institute of Science and Technology, as a recipient of an MII nano-imprint machine.

Similarly, although Cool Chips said its facility is operational, it did not give a timetable for the commercial ramp-up of production, but said there are production and packaging issues” that the company is actively addressing.

The new facility includes an automated vacuum deposition evaporator as used for metallization in wafer fabrication, Cool Chips said, adding that it uses the equipment to form the two halves of a sandwich that is set up to include a vacuum gap of less than 10 nanometers. Tunneling by electrons across the nanometer vacuum gap is at the heart of Cool Chips' cooling claims. The gap acts as an insulator, so that heat is not conducted back across the gap, the company claims (see August 6, 2002, story).

LQR2V392MSEHBB_Datasheet PDF

The company said it is meeting targets for the manufacture of quantum thermo-tunneling devices capable of pumping 3 to 5 watts of heat across a surface area of one square centimeter.

The ability to reliably produce the core sandwich in good quantities is an important step towards the goal of manufacturing working Cool Chips that can be packaged and sold for a variety of high-value applications,” said Isaiah Cox, Cool Chips president, in a statement.

SAN JOSE, Calif. — The EDA Consortium reelected Mentor CEO Wally Rhines as its board chairman and elected one new vice chairman and two new directors at an EDAC meeting here on Monday (April 19).

LQR2V392MSEHBB_Datasheet PDF

EDAC's new directors are Kathryn Kranen, CEO of Jasper Design Automation, and Jim Douglas, CEO of ReShape. They replace Mike Tsai, former CEO of Verisity-acquired Axis Systems and Nassda CEO Sang Wang on EDAC's board.

EDAC directors also promoted Alan Naumann, CoWare's CEO to vice chairman. Cadence Design Systems CEO Ray Bingham remains as EDAC's other vice chairman.

LQR2V392MSEHBB_Datasheet PDF

Other industry executives reelected to EDAC's board include Bernie Aronson from Synplicity, Jacques Benkoski from Monterey Design, Moshe Gavrielov CEO of Verisity and Synopsys CEO Aart de Geus.

EDAC board members serve two-year terms.

MÜNCHEN &#151 In den Ausbau und die Erweiterung ihrer DRAM-Fertigung in Richmond (USA) will Infineon eine Milliarde US-Dollar investieren. Dazu soll in der Fabrik eine Fertigungslinie für 300-mm-Wafer eingerichtet werden; die Produktion soll Anfang 2005 beginnen. Die vorhandene 200-mm-Linie läuft weiter.

?Die Nachfrage der Kunden nach Logik- wie auch nach Speicher-Chips steigt stark an. Dank dieser Kapazitätserweiterung in Richmond können wir unser 200-mm-Werk in Dresden schneller von Speicher- auf Logik-Produkte umstellen”,begründet Infineon-CEO Andreas von Zitzewitz die Entscheidung. ?Wir nutzen den vorhandenen Rohbau und die Synergie-Effekte, die wir mit den erfahrenen Mitarbeitern in Richmond haben, um die 300-mm-Kapazität schnell und in Übereinstimmung mit unseren Investitionsplänen verfügbar zu machen.”

Nach Abschluss der ersten Expansionsphase will der Hersteller in der Fab Richmond monatlich 25 000 Waferstarts erreichen. Im neuen 300-mm-Produktionsmodul werden zunächst modernste DRAM-Chips in 110-nm-Technologie hergestellt, wobei eine schnelle Umstellung auf 90-nm-Produkte geplant ist. Das am Standort Richmond unter Volllast betriebene 200-mm-Modul bleibt weiter in Betrieb. Die nach Abschluss der ersten Ausbaustufe erwartete Kapazität von 25 000 Waferstarts pro Monat soll die Gesamtkapazität an DRAM-Chips in Richmond mehr als verdoppeln. Gleichzeitig will Infineon die Belegschaft um 800 auf etwa 2550 Mitarbeiter aufstocken.

Das Werk in Richmond wurde 1996 als White Oak Semiconductor gegründet und nahm im August 1998 die Produktion von Speicherchips auf. Die Bauarbeiten an der 300-mm-Erweiterung wurden bereits im Jahr 2000 begonnen, die Fertigstellung wurde aber aufgrund der konjunkturellen Rahmenbedingungen verschoben. Das Werk produziert DRAM-Chips für den Einsatz in PCs und Servern.

With the major cooling issues for desktop machines behind them, makers of fan-management ICs are digging deeper into their bag of tricks to minimize audible fan noise in systems extending to servers and the manufacturing floor. Indeed, acoustic noise is as much a human-factors issue today in such areas as the industrial test facility and is the hostile environments under which various equipments operate. The road to killing the noise, particularly with the PWM-type (versus on/off and linear) fan controllers in wide use today, is to improve the chip's accuracy. Thus, vendors are focusing on better temperature-sensing devices in the fan IC and, for the corresponding feedback control loops, improving the compensation for various resistive and capacitive elements. More fan controllers can be programmed to other than a linear speed-versus-temperature response, which of itself tends to make for noisy operation. Other features include a trend towards various instant-ready circuitry to overcome the inertia required to start fans moving and, in general, circuitry to control the rate at which fans change speed. Power-up stepping circuitry for the fans (from the basic 2-wire brushless types to the popular 3-wire and now 4-wire versions for advanced applications) also cuts down on the noise that would otherwise be generated by a sudden change to full speed. Apart from the contentious issue of using a system microcontroller, most of today's devices communicate with an SMBus interface.

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