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TSM-102-03-S-DV-P-TR

来源:LM317 Electronics Components编辑:UDOO时间:2021-06-15 13:52:16

The NXE:3100 has demonstrated the ability to print 32- and 40-nm dense contact holes, Wagner said.   Using dipole resolution techniques, the system has demonstrated the ability to print images down to 20-nm, he said. In logic, the machine was said to pattern an SRAM down to 18-nm, he said.

The stated goal of the tool is to have an overall throughput of 60 wafers an hour by year’s end. But right now, the tool has a throughput of 5 wafers an hour. In other words, the tool requires a ''10X’’ improvement in the power source-or about 100 watts-to meet the stated goal of running 60 wafers per hour, he said.    

TSM-102-03-S-DV-P-TR

To become a viable business model for fab tool vendors, EUV must have a sustained throughput of 80 wafers an hour, according to a KLA-Tencor executive.

At present, ASML has two power source suppliers for the tool: Cymer Inc. and Ushio Inc. Cymer has devised a power source based on laser-produced plasma (LPP) technology.  At present, Cymer’s LPP source is running at a sustained power of 11 Watts, according to ASML.

Rival Ushio is developing a power source based on electric discharge technology. At present, the source has demonstrated 12 watts of power, according to ASML. Another vendor, Gigaphoton Inc., has demonstrated 20 Watts of power.

TSM-102-03-S-DV-P-TR

ASML has shipped two NXE:3100 tools. In total, it has six orders for the machine. Following the NXE:3100, the company has been developing the previously-announced NXE:3300, a full-blown production machine.

The first version, dubbed the NXE:3300B, has an NA of 0.33 and a resolution of 0.22-nm. Originally, the NXE:3300B had an NA of 0.32, but the company has bumped up the NA specification to 0.33.

TSM-102-03-S-DV-P-TR

The stated goal for the tool is to have a sustained throughput of 125 wafers an hour, meaning that a 250 Watt power source is needed for the system.  Shipments are due in the first half of 2012. ASML has ten orders for the system.

SAN JOSE, Calif. – LSI Corp. has signed a definitive agreement to sell its external storage systems business to NetApp Inc. for $480 million in cash.

Visit Enclustra at http://www.enclustra.com .

This article originally appeared on EE Times Europe.

LONDON – Semiconductor Manufacturing International Corp. made a net income of $14.0 million on sales revenue of $1,554.8 million in the 2010 calendar year. The company announced that sales were up 45.3 percent from $1,070.4 million in 2009 and the company turned round to a net profit from a loss of $962.5 million in 2009.

The results are an audited update to the fourth quarter financial results announcement made on Feb. 17.

The sales increase was primarily due to an increase in overall wafer shipment. For the full year 2010, the overall wafer shipments were 1,985,974 units of 8-inch equivalent wafers, up 44.3 percent year-on-year. The average selling price of the wafers the company shipped increased by 0.6 percent from $778 per wafer to $783.

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