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TSM-104-01-L-DV-A-P

来源:LM317 Electronics Components编辑:Maxwell Technologies, Inc.时间:2021-06-14 03:33:54

The PC went through much iteration over the next 25-30 years, improving in all aspects. Intel and Microsoft benefited greatly from their initial selection by IBM. They further benefited from improvements in speed, power capability, and greater utility in many types of commercial, scientific, and industrial applications. Other companies benefited as well leading to greater usage in almost all systems.

The new system-on-chip (SoC) products will be designed and marketed by Mitel worldwide and manufactured by IBM Microelectronics.

The two companies said the partnership combines Mitel's expertise in demodulation and digital television technologies with IBM's PowerPC-based set-top box controller functions and copper-chip processing technology. A range of SoC devices are now planned for new integrated digital TV (iDVT) sets and advanced set-top boxes.

TSM-104-01-L-DV-A-P

As part of the alliance, Mitel and IBM have entered into a licensing and manufacturing pact. Mitel's ICs will be fabricated by IBM, using a 0.18-micron CMOS copper chip technology.

The adoption of digital TV depends significantly on semiconductor companies designing highly integrated and cost-effective chips for manufacturers,” said Paul Fellows, DTV product line manager at Mitel Semiconductor. We are working closely with our lead customers to help them deploy iDTV integrated digital television sets and other products which fully exploit Mitel's silicon and software capabilities.”

According to a forecast by Cahners In-Stat Group, the global market for digital TV will reach $4 billion by 2004, an increase from $800 million in 2000.

TSM-104-01-L-DV-A-P

Mitel's first digital TV chips will be aimed at the European digital video broadcasting terrestrial (DVB-T) standard.

The semiconductor industry must select from a wide variety of materials for substrates, channels, gates, and contacts as it scales transistors from 10 nm to 7 nm and beyond.

TSM-104-01-L-DV-A-P

For logic [at 14 nm and 10 nm], the architectures are defined,” said Raj Jammy, general manager of the semiconductor group at Intermolecular Inc. and one of several scheduled presenters on the topic at Semicon West in July. In most cases, they are FinFETs, but there is also an alternate option, which is fully-depleted SOI.”

For both 10 nm and 7 nm, he thinks that high-k metal gates will tend to be dominant, but the real challenge will be the channel itself. At 10 nm, germanium (Ge) will likely be one of the channel materials. But the moment you add Ge, a whole range of questions open up.”

The slow uptake of USB 2.0 is part of what's making 1394 look more attractive to system OEMs, observed Curtis Stevens, senior consulting engineer at Phoenix Technologies. We are seeing accelerated interest in 1394 today,” he said.

Indeed, OEMs' quandary over 1394 vs. USB 2.0 is now coming down to more of a matter of timing,” said Pinzarrone of EndPoints. Despite growing interest in USB 2.0 over the last two years, limited support on the PC-host side is prompting some system vendors to start asking us about 1394 and the upcoming 1394b,” he said. Without a USB 2.0-ready host, manufacturers don't have a platform to test their new USB 2.0 peripheral against, he explained, making product introduction riskier.

USB 2.0 is hampered by the fact that Microsoft Corp. is extending only limited support for the spec in its next-generation operating system (see related story). The initial release of Windows XP features only 1394,” said In-Stat's Kirstein.

Further, Intel Corp.'s PC core logic chip set integrated with USB 2.0, designed to go into PC motherboards, won't be on the market until 2002.

Jason Ziller, president and chairman of the USB Implementers Forum Inc. and a technology initiative manager at Intel, said that USB 2.0 significantly improves data throughput performance for storage devices, printers, scanners and digital still cameras — markets where USB 1.1 is dominant today.

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