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ALS70A752NW500_Datasheet PDF

来源:LM317 Electronics Components编辑:OptConnect时间:2021-06-15 15:24:59

AG Associates' Heatpulse 8108 is designed to meet the full range of RTP process challenges for devices featuring less than or equal to 0.35-m design rules. This system offers high throughput and system uptime along with thermal uniformity, repeatability, slip-free processing, and exacting contamination control.

Milpitas, CA–December 16, 1996–LSI Logic Corp. (Milpitas, CA) announced the immediate availability of a new Small Form Factor Package (SFP) family for complex ASIC chips, called the mini-BGA (Ball Grid Array). Inexpensive mini-BGAs meet existing JEDEC standards, yet they can accomodate the wide range of chip sizes used in ASICs. Since these are extensions of existing packages, volume manufacturing capability is in place worldwide, and the packages offer a very low-risk solution for new system designs.

Targeted at high-volume consumer and portable markets like digital cameras, cellular telephones, personal digital assistants, etc., the mini-BGA SFP offers the same electrical and thermal performance as the plastic ball grid array (PBGA) package in a much smaller size. This package is only 15-mm square and is less than 1.5-mm high.

ALS70A752NW500_Datasheet PDF

The packaging demands for ASIC chips are as varied as the ASIC devices themselves in terms of size, leadcount, and performance requirements. The mini-BGA package is basically a ball grid array with a single-core laminate substrate, wirebonds, and overmolding for protection of the die.

The solder ball pitch on the package is 1.0-mm, which is a JEDEC and EIAJ standard. This pitch is intermediate between PBGA and CSP (Chip Scale Packages), and offers a smaller package size without making the ball array so dense that Printed Circuit Board (PCB) routability becomes a concern.

The solder balls are configured as four peripheral rows, with thermal vias in the center to dissipate heat into the system PCB. Since the typical applications for this package have low thermal dissipation, no extra thermal enhancements should be necessary. The outer rows of balls are routed directly to bondfingers on the substrate. These can be used as signal, power, or ground connections. Due to the short tracelengths on this small package, electrical parasitics are lower than a comparable pincount Plastic Quad Flat Package (PQFP), and less than or equal to a comparable PBGA.

ALS70A752NW500_Datasheet PDF

The mini-BGA is a low-risk solution for immediate implementation since it is an extension of known PBGA technology. LSI Logic has shipped several million PBGA packages to date, and package reliability is well characterized in the industry. In terms of supply, multiple PBGA manufacturing houses are qualified as sources for LSI Logic.

SFPs are available from LSI Logic now, and are priced in the context of the specific ASIC and the total volume ordered.

ALS70A752NW500_Datasheet PDF

LSI Logic 1551 McCarthy Blvd. Milpitas, CA 95035 (408) 433-8000 http://www.lsilogic.com

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HP's multiple-board-versions software permits developers to write and debug a master test program for the base board, and then define and debug the differences between the base board and its subsequent versions. Once the data is entered, tests are automatically generated, including special file structures and fixture files. Subsequent changes can be made and implemented selectively.

HP's multiple-board-version software is currently included in all new HP 3070 Series II board test systems, and as a free upgrade to HP Series II customers who currently have HP software maintenance and support contracts.

Hewlett-Packard Palo Alto, CA http://www.hp.com/go/tmdir

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Mountain View, CA–December 4, 1996–Quickturn Design Systems Inc. (Mountain View, CA) has announced an award from two divisions of Sun Microsystems, Sun Microsystems Computer Corp. (Chelmsford, MA), and Sun Microelectronics (Sunnyvale, CA).

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