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CRCW080530R9FKEB_Vishay Dale_Chip Resistor - Surface Mount

来源:LM317 Electronics Components编辑:Molex时间:2021-06-15 13:54:31

You can set rules for routing calls to agents based on when calls arrive, agents' availabilities and their skills. Agents can accommodate up to six parties on one conference call.

Not everybody is ready to move to cacheless processor cores, though. NEC Corp., for one, has just added 256 kbytes of Level 2 cache as well as an SDRAM controller to its latest 64-bit Vr7701 processor core in order to lessen memory access delays.

Distancing the cache from the processor may make sense for 32-bit cores used in cost-sensitive SoC devices, but it will mean a performance hit, said Arnold Estep, senior marketing manager for Vr products at NEC.

CRCW080530R9FKEB_Vishay Dale_Chip Resistor - Surface Mount

When the cache is tightly coupled to the core, you can guarantee that you'll get the data from the cache in one clock,” he said. If it's an SRAM in an SoC, you don't have a lot of control over the access time.”

IBM Corp. is taking yet another approach with its latest 440GX PowerPC processor, designed with the company's 0.13-micron ASIC methodology. It includes an L1 instruction and data cache and 256 kbytes of software-controlled SRAM that transfers data over the processor's local bus at 5.3 Gbytes per second. In this way, the L2 cache can ostensibly be shared more readily by other elements.

Memory maker Micron Technology Inc., meanwhile, will disclose details at the forum of its SC-1 processor, based on a synthesizable MIPS 32-bit 4Kc core surrounded by 8 Mbytes of embedded DRAM fabricated on Micron's 0.18-micron process technology. Rather than having the processor go out over I/O buffers and pc-board traces to fetch data from DRAM, the SC-1 brings the DRAM on the same die to reduce read and write latencies. The chip includes a link to external flash memory and to external DRAM as an option, Micron said.

CRCW080530R9FKEB_Vishay Dale_Chip Resistor - Surface Mount

Reconfigurable twists

While memories will be one point of debate at the Embedded Processor Forum, the use of reconfigurable processor cores will also be a topic of discussion as more players enter this space and others extend the capabilities of their offerings.

CRCW080530R9FKEB_Vishay Dale_Chip Resistor - Surface Mount

Toshiba Corp. is set to pull its weight in the configurable-core market this week, when it describes a media processor architecture billed as configurable and extensible. Another large chip vendor taking an interest in configurable processors is Europe's STMicroelectronics, which will describe a face-recognition processor based on the Xtensa core licensed from Tensilica Inc. ST created a customized version of Xtensa because it needed a way to process an enormous number of clock cycles in real-time to match a facial image with those that reside in a database, something the company said can't be done with a digital signal processor.

Both Tensilica and rival ARC Cores will also describe how they are tailoring their cores for specific applications. ARC is set to discuss telephony DSP extensions for voice-over-Internet Protocol (VoIP) and voice-over-DSL applications.

German DRAM maker Infineon Technologies A.G. tested the waters in Korea briefly last December but backed off quickly. Infineon is now meeting its capacity needs by building a 300mm-wafer fab with Nanya Technology Corp. of Taiwan, and through large DRAM supply agreements with Winbond Electronics Corp. and Mosel Vitelic Inc., also of Taiwan.

Hynix's Korean counterpart, Samsung Electronics Co. Ltd., has loudly rejected any attempt to fuse the companies despite a government trial balloon floated earlier this year. Samsung resisted government pressure in 1998 to take over the semiconductor oper-ations of Hynix (then Hyundai Electronics Co. Ltd.) in a so-called Big Deal.” The government subsequently forced Hyundai and the former LG Semicon into a marriage that contributed greatly to the debt load Hynix is now carrying.

Likewise, China's emerging chip industry, consumed with its own domestic growth, is not expected to produce any bidders, according to analysts, although a few companies there are in the market to buy used manufacturing equipment from Hynix.

SAN JOSE — Worldwide chip sales grew 7.2% to $10.75 billion in March from $10.03 billion in February, posting the highest month-to-month increase since April 1986, according to a new report released today by the Semiconductor Industry Association here.

Just like in 1986, the semiconductor industry appears to be recovering from its worst downturn in history. Compared to sales in March 2001, worldwide semiconductor revenues were 25.4% lower than $14.41 billion in the same month last year, said the SIA.

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