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GCM2165C1H751FA16J_Murata Electronics_Ceramic Capacitors

来源:LM317 Electronics Components编辑:FreeWave Technologies, Inc.时间:2021-06-15 14:31:46

On a press conference in Frankfurt, Germany, Siemens CEO Klaus Kleinfeld also announced future plans to restructure the remainder of the COM business. According to Kleinfeld, the wireless modules business will be integrated into Siemens' Automation & Drives division (A&D) by October 2006. The far bigger enterprise networks division is planned to be spun off – but before doing so, Kleinfeld wants to strengthen the position of this activity in the global market for enterprise networks so that it will rank second – presumably after US networks giant Cisco Systems.

Researchers from Bonch-Bruevich University are participating at the Third International Russian Communication Association Conference this week (June 9-16) in St. Petersburg, Russia. The conference combines technology developments with communications influence on society.

The conference theme Communication and (Re)Making Social Worlds” includes support by the North American Russian Communication Association—the western branch of the Russian Communication Association—and leading universities of the St. Petersburg area, including St. Petersburg State University, St. Petersburg-M.A. Bonch-Bruevich State University for Telecommunications, St. Petersburg State Polytechnical University, Nevsky Institute of Language and Culture, and the St. Petersburg Institute of Foreign Economic Relations, Economics and Law.

GCM2165C1H751FA16J_Murata Electronics_Ceramic Capacitors

Other conference topics include mediated communication and advanced information technologies, mass and media communication, and communication and culture.

Marknaden för mobila kommunikationsprodukter, som innehåller Pocket/Palm-displayer, har ökat enormt de senaste åren. De traditionella användarna av passiva LCD-displayer går idag mot att använda TFT i stället.Henrik Rannelid, applikationsingenjör för displayer inom EG Display och System AB, som består av gamla MIKO Components och EG Components display division, beskriver här en utvecklingsmiljö som gör det enkelt och snabbt att bygga en prototyp, skapa avancerad grafik, och utvärdera nya, små färgdisplayer.

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GCM2165C1H751FA16J_Murata Electronics_Ceramic Capacitors

Maple Grove, Minn. — The A5 series 40-amp automotive relay from CIT Relay & Switch is available with U.S. and European PC layout styles. The European style is CE certified.

Designed for high in-rush applications, the A5 series relay features excellent vibration and shock resistance as well as high heat resistance for use in high ambient temperature applications such as engine compartments. The A5 relay, which measures 25.8 x 20.5 x 20.8 mm, can carry a continuous current of 20 amps at 125°C. This device may also be used in automotive anti-lock braking systems (ABS), power steering, power windows, door locks, wipers, tilt lock wheel, sun roof, emergency vehicle lighting and lamp accessories.

GCM2165C1H751FA16J_Murata Electronics_Ceramic Capacitors

Available with SPST N.O., SPST N.C. or SPDT contact arrangements, the specially formed contacts of the A5 relay are weld resistant. The SPST N.O. arrangement offers contact ratings of 40A at 14 Vdc, 20 A at 120 Vac and 15 A at 28 Vdc. Both the SPST N.C. and the SPDT arrangements offer 30 A at 14 Vdc, 20 A at 12 Vac and 15 A at 28 Vdc. Other key specifications include a maximum switching power of 360 W, a maximum switching voltage of 750 Vdc, 380 Vac, and a maximum switching current of 40 A.

TfI has received an investment from an Irish venture capital company called 4th Level Ventures and is finalizing an agreement for investment with Enterprise Ireland.

We're pleased to have investors onboard who understand the technology commercialization business and in particular have a great deal of experience in working with academic institutions,” said Richardson in a statement.

TfI will be providing the academic institutions in Ireland with a valuable and much needed service of focused, market led technology development expertise,” said Ray Naughton of 4th Level Venture, in the same statement.

MANHASSET, N.Y. — Toshiba America Electronic Components Inc. has introduced a multi-chip package that, in addition to standard MCP memory devices, integrates a gigabyte1-class NAND flash memory with an SD card interface controller.

Designated the GB MCP, the package is slated to reach mass production in August and compete with Micron’s Managed NAND package and compete against products from M-Systems Flash Disk Pioneers Ltd. and Samsung Electronics Co. Ltd.

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