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MTSW-106-08-S-S-225-NA

来源:LM317 Electronics Components编辑:Xicon时间:2021-06-14 03:57:45

According to sources, the officials in the Commerce Department have expressed concerns about Tinsley's technologies being owned by a foreign company.

Motorola has expanded its portfolio of Flash-based hybrid controllers. The 56F826 and 56F827 are based on the 56800 core that integrates the performance of DSPs with the functionality of microcontrollers (MCU) into a single architecture. The 56F826 and 56F827 add improved synchronous serial Interfaces and DAC-capable timers to the product family. Target applications for the 56F826 and 56F827 include point-of-sale terminals, uninterruptible power supplies, handheld devices, feature phones, robotics, motion control, and security systems. A low power consumption suits the devices to battery-operated products.

The 56F826 provides: 36kx16 Flash memory, 4.5kx16 RAM, 2 serial communication interfaces, 2 serial port interfaces, synchronous serial interfaces, quad timers, interrupt controller, up to 48 general purpose I/O lines, external memory interface, JTAG/OnCE port, power supervisor and time of day in a 100 LQFP.

MTSW-106-08-S-S-225-NA

The 56F827 has 68kx16 of Flash memory, 5kx16 of RAM, 3 serial communication interfaces, 2 serial port interfaces, synchronous serial interfaces, quad timers with DAC capability, interrupt controller, 52 general purpose I/O lines, external memory interface, JTAG/OnCE port, power supervisor and a 10-channel, 12-bit A/D converter in a 128 LQFP.

Motorola, in conjunction with its Metrowerks subsidiary, has created a development environment for the 56F800 family. Additionally, Motorola offers an embedded SDK softwaredevelopment kit). The 56F826 is immediately available for production orders supported by Metrowerks CodeWarrior 4.0, the SDK 2.3 and evaluation modules (EVMs). The 56F827 is scheduled for sampling, development tool availability and production release in Q3.

I just saw a Kickstarter project that has me drooling with desire. This is my chance to have a truly immersive experience as I meander through a strange world populated by fantastic scenery and incredible architecture.

MTSW-106-08-S-S-225-NA

Do you remember the album covers for the band Yes that were created by the English artist, designer, architect, and publisher — Roger Dean? When I was a young lad, I used to love the strange worlds he created with their fantastic landscapes and organic structures, such as the one shown below:

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I always wished I could somehow transport myself into these worlds and wander around and explore them. To some extent, this capability is provided by today’s computers. Generally speaking I’m not a big player of computer games, but there are a couple that I simply could not resist — Myst and Riven. These are immersive reality games in which you move through strange worlds solving puzzles and suchlike. Myst and Riven came before the days of high-speed graphics cards and the computational capabilities to render high-quality 3D images on-the-fly. What they did was to pre-render photo-realistic still images of the various scenes, such as the one from Riven shown below. Then you clicked on different directions with your mouse to move through the landscape.

At the third annual interposer workshop hosted by Georgia Tech’s Packaging Research Center (PRC) packaging specialists such as Amkor and ASE clearly stated they are ready to assemble and test interposer-based designs. Globalfoundries detailed its strategy to partner with such OSATs for implementing these designs.

In a mega-panel moderated by Matt Nowak, a 3D stacking expert at Qualcomm, more than a dozen experts discussed a few technical and many business challenges related to interposers. They concluded the technology is ready but we need lower costs.

In a separate talk, Phil Garrou of market watcher Yole Development agreed with the assessment. Nevertheless, further improvements in pad and line pitches are needed to enable higher bandwidths for future video applications, according to an Altera keynote and material suppliers.

The event included discussions of packaging for RF, MEMS, sensors, passives, and camera applications. In a poster session about 30 students outlined their interposer-related projects, followed by impressive presentations from GIT’s PRC and Korea’s KAIST.

Major semiconductor, equipment, and materials vendors attended the event, and I was impressed with the progress our industry has made since I attended the first workshop in November 2011. But the bad news was when an organizer asked at one session how many IC designers were in the audience he found only one.

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