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0358270001_Molex_Unclassified

来源:LM317 Electronics Components编辑:Quick Logic时间:2021-06-15 15:25:27

Die Maßnahme erhöhte den Cadence-Umsatz mit PCB-Tools gewaltig. Dennoch musste das Unternehmen 1999 die Marktführerschaft an Mentor abgeben, weil Cadence seine Lizenzstrategie drastisch änderte, und zwar von Dauerlizenzen und zeitbasierenden Lizenzen zu Abonnements. Während OrCAD über eine hochvolumige und kostengünstige Produktreihe verfügte, wurden die Cadence-Produkte im Direktverkauf abgesetzt – also hohe Kosten und geringe Stückzahlen. Deshalb entschied das Unternehmen vergangenes Jahr, den OrCAD-Verkauf über den Value Added Reseller (VAR) EMA abzuwickeln. OrCAD war mit dem VAR-Verkauf besser dran als mit uns,” bemerkt Metcalf.

Functional verification is acknowledged to be the most time-consuming task in IC development, accounting for as much as 70 percent of overall development time. That percentage is not likely to decrease as designs are implemented in more-advanced processes.

High mask costs mean that people targeting 90 nm are going to put as much programmability and configurability as they can into their chips,” said Steve Glaser, vice president of corporate marketing and business development at Verisity (Mountain View, Calif.). It means that they can use the same silicon for multiple product lines.” But verifying such a complex chip will be an enormous task.

0358270001_Molex_Unclassified

So the three partners are creating common data models that will bridge their respective tool sets and areas of expertise: Verisity's testbench technology, 0-In's formal and assertion-checking tools, and Novas' hardware debug. The partners hope the common models will create a unified flow for verification process automation (VPA) that will sit atop a verification infrastructure” of third-party simulators, accelerators and emulators. They are focusing initially on hardware verification but plan to address software down the road, likely through an expansion of the alliance.

The idea of the collaboration is to automate all of the engineering-intensive tasks in the verification process,” said Dave Kelf, vice president of marketing at Novas (San Jose). The companies hope their collaboration will shrink the time required to perform functional verification by a factor of 10.

VPA will allow a verification plan to be created that can be effectively distributed to various team members for system, chip- and unit/block-level verification. It is also intended to automate many of the tasks overseen by verification team members.

0358270001_Molex_Unclassified

Verisity will define the top-down, spec-driven verification management process, extending from an executable verification and coverage metric plan to the composition of a multilevel environment for unit, chip and system verification.

0-In will define the implementation-centric design-for-verification flows, incorporating assertion-based and formal verification. Assertions will link the design with the specification and may span multiple levels of abstraction, the companies said. 0-In will provide two processes. The first will focus on verification hotspots that are verified with formal verification techniques. The second will address critical coverage points in a design that can be monitored with assertions in dynamic verification.

0358270001_Molex_Unclassified

Novas will define the debug and failure analysis flows spanning the range of activities from signal to transaction levels. That will allow users to detect the root cause of bugs in the VPA flow, Kelf said.

The companies' common data models will allow their respective tool suites to work tightly together and to be viewed by users as a unified environment, said Richard Ho, cofounder and senior architect at 0-In Design (San Jose).

Suppliers are integrating antenna switches and SAW filters into front-end modules and are integrating power amps with auxiliary control circuitry to form power amplifier modules. But with low-cost phones still dominating mobile-phone shipments, de-

mand for older, discrete parts such as SAW filters remains strong, forcing suppliers to continue to stock them along with the integrated solutions they're developing for next-generation handsets.

It remains to be seen whether the high end will pick up,” said Philip Gadd, worldwide marketing manager for the Wireless Semiconductor division of Agilent Technologies Inc. (San Jose, Calif.). The slower-than-expected rollout of third-generation phones has been one factor in the lackluster device sales thus far, Gadd said.

Because 3G and advanced phones are more apt to incorporate features such as gaming and Internet access, they are more likely to use integrated parts to pack more functions in a smaller space. But analysts say OEMs will balk at designing in integrated parts if those devices raise the cost of the phone. Mobile-phone suppliers want to reduce costs as they increase functionality,” said Scott Smyser, an analyst for iSuppli Corp. (El Segundo, Calif.). They want the functionality but don't want to pay a premium.”

Though analysts and suppliers say the cost premium for integrated parts is difficult to quantify, they acknowledge that limited production yield often results in the integrated devices' commanding a premium over discrete parts.

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