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来源:LM317 Electronics Components编辑:GlobTek, Inc.时间:2021-06-15 15:27:18

The benefits are many fold. First the user interface is much more intuitive, you no longer have to imitate a cursor across a screen and move to reach a fixed icon on its XY coordinates, start moving in the icon’s direction and you’ll trigger a new layout of options.

She illustrated this with seven generations of iPhones, thinning from around 12mm to 7mm while increasing their WLP content from 2 dies to over 26 dies.

measuring inductor

The conventional WLPs trends, she said, include higher I/O counts and larger dies. And together with shrinking geometries, the number of I/Os per die dramatically increased over the years from a few dozens to well over 400, calling for multi-die packages or a move to larger FO-WLP where the I/Os can be distributed not only underneath the die but at the package’s periphery (like extra margins surrounding the die).

Typically, FO-WLP benefit from the same thinness (under 0.4mm) but can integrate multiple dies from different technology nodes, as well as some passives. Nanium offered a good example by moulding together two active dies and 10 surface-mounted passives within a 9x8mm package.

measuring inductor

According to TechSearch, FO-WLP could reach over 1.8 billion units per year in 2019, versus less than 300 million packages shipped in 2014. But then, if the trend is to continue, the real-estate on reconstituted wafers will become the limiting factor for optimized larger package integration and cost efficiency, since the piece count remains limited or is even reduced (as the packages grow) on a wafer-like substrate.

As the declining average selling price for end products creates further price pressure, it drives OSATS to develop lower cost package options too, moving to large area packaging beyond today’s wafer sizes. This is where the wafer fab side, back end assembly, and PCB segments are merging” she said.

measuring inductor

Citing a few examples of panel-sized FO-WLP R&D efforts up to 610x457mm2, Vardaman concluded that panel-based processing has a promising future despite the numerous technical challenges it brings with it.

These challenges, just to name a few, include large panel manipulation (new infrastructures moving the dies from wafer-level processing machines to larger panel-capable equipment), die placement accuracy across large panels, panel warpage and new dispensing processes altogether to achieve sufficient molding uniformity and planarity.

The number of design rules is going up and thus the complexity of designs is going up, making our tools more and more important to the semiconductor design flow,” Porter told us.

IBM also claims that it has invest over 50-to-100 years of research and development into its tools and have been using them internally for 10-to-20 years on real-world chip designs by more than 1,000 engineers on as many as 500,000 jobs producing over 100 unique mainframe and Power microprocessors, interconnects, application specific integrated circuits (ASICs) and more. Other EDA toolkits are relative newbies in comparison, IBM claims.

It expects its tools to be used by enterprise-class organizations to design systems-on-chip (SoCs) for mobile phones, wearables and Internet-of-Things devices conceived by small-to-medium sized businesses who will appreciate the cost savings of cloud-based EDA design flows.

Each user will be assigned its own server for both physical and network isolation including firewalls and other proprietary techniques for securing clients data. Clients need only workstations to access the complete design flow toolkits of SiCAD, with no requirement for licenses, data centers or IT staffs.

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