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来源:LM317 Electronics Components编辑:DeLorme时间:2021-06-14 03:56:05

Mit seiner Forderung nach Einbeziehung der gesamten Photomasken-Problematik unterscheidet sich der Standpunkt der Symposiums-Protagonisten deutlich von dem designorientierten Blickwinkel, der sich auf Entwicklungsrichtlinien für IC-Layouts und auflösungssteigernde RET-Technologien wie die OPC-Technik (Optical Proximity Correction) konzentriert. Aus Entwicklersicht ist DFM ein Prozess, der die Chipausbeute sichern soll.

The dirty little secret of digital is that it has not been as efficient [at power conversion] as analog power ICs. That is the crux of the matter for the digital guys,” he said.

The chip knows what the absolute operating conditions are, and can use that data to its advantage” to keep conversion efficiencies high, Templeton said.

CMF5592K000BHEA_Vishay Dale

Chris Ambarian, power IC analyst at market research firm iSuppli Corp., said the power industry shifted three decades ago toward switched-mode power MOSFETs. That was a huge change, and this change, to the digitalization of power, is that big, possibly bigger,” he said.

The Zilker engineers, said Ambarian, are pretty creative, and I think what they have done is absolutely stunning from a technical standpoint. This will facilitate a lot of things. The fact that they did it in a fully digital implementation means that it is configurable on the fly, on a cycle-by-cycle basis.”

By putting both conversion and management on the same die, Zilker offers system designers a means of applying programmable intelligence to power distribution and monitoring. That can result in large power savings for such systems as server or storage farms, or rack-mounted telecommunications and data communications systems. These dense board-level systems have extremely complex and dense power requirements, and curbing the board area required for power ICs is critical, the iSuppli analyst said.

CMF5592K000BHEA_Vishay Dale

Zilker is a 35-person startup, based here, which is applying digital CMOS design techniques to power-conversion challenges largely handled by analog parts. It joins a fast-growing list of power vendors with similar goals, including ADI, iWatt, Linear Technology, Maxim, National Semiconductor, ON Semiconductor, Philips,

Primarion, Silicon Laboratories, Texas Instruments and Volterra.

CMF5592K000BHEA_Vishay Dale

We must give power system designers a little bit of education” to use a digital part, said Zilker CEO Bob Bridge.

Susie Inouye, analog analyst at market researcher Databeans, said power is one of the largest and fastest-growing markets for the linear IC vendors; revenue is expected to double during the next five years. The problem with digital power is that power engineers are not used to programming,” she said.

ArctiCore's patent-pending technology enables enterprise and consumer OEMs to cost-effectively increase available memory capacity to meet expanding application performance requirements. Utilizing a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core, ArctiCore dramatically increases the available area for mounting devices while enhancing thermal management, reliability and thinness compared to conventional module technologies.

ArctiCore uses an aluminum core that acts as a heat sink and mechanical stiffener. This provides rigid foundation support and increases the contact area for dissipating heat away from the devices, resulting in heat reductions ranging from 4 (degrees) to 25 (degrees) Celsius, and also improves factory yield losses due to handling fallout. ArctiCore minimizes BGA ball stress cracking and reduces wear and tear through the use of a tapered connector edge that lessens system insertion stress.

We have applied our technical expertise in thermal management, high-density package stacking, electrical interconnect and standard assembly process to solve the memory density challenges for a range of enterprise and consumer applications, such as high-density memory products for end-user markets including servers, PCs, PDAs, MP3s, camcorders and other mobile devices,” said Wayne Lieberman, President of Staktek Holdings. ArctiCore creates an unprecedented level of DIMM thinness that rewrites the rules for high-capacity memory systems,” concluded Mr. Lieberman.

During the course of developing our product portfolio based on more than 150 patents and applications pending, we realized that all advanced system designs face increasing complexities in density, thermals, signal routing and manufacturing yield – we believe that ArctiCore is the solution that addresses each of these issues,” said James Cady, Staktek's CEO and acting CTO.

ArctiCore is extremely effective and efficient in addressing the demanding speed, space and functionality requirements for next-generation systems,” said Damian Cook, General Manager of Staktek's Enterprise Business Unit. In server systems, for example, space for DIMM slots is at a premium, and airflow is restricted with thicker standard DIMM technologies. ArctiCore increases the space and airflow between DIMM slots with a module footprint that is 35% to 45% thinner and, along with the aluminum core, creates a superior thermal cooling solution without compromising system capacity or performance.

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