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B41042A8686M_Datasheet PDF

来源:LM317 Electronics Components编辑:Amphenol SGX Sensortech时间:2021-06-15 14:12:53

Dozens of savvy, worldwide companies have already put years of efforts into incorporating some or all of these design elements in industries ranging from furniture and flooring to telecommunications and tools. For example:

Consequently, companies that prioritize finding tangible, methodical ways to reduce material costs and improve processes will be leaders in maintaining profit margins.

Sustainable Goals, Directives and Tactics

B41042A8686M_Datasheet PDF

Although Europe, with its more limited land and resources, leads the way in suggesting and enacting programs aimed at sustainability, American manufacturers aiming for those markets will have to take heed and comply. A number of EU regulations already in place will radically impact the way products are designed and marketed, from cell phones to sports cars.

For example, the Waste of Electrical and Electronic Equipment (WEEE) and End of Life Vehicles (ELV) Directives are both based on the principle of extended producer responsibility. WEEE requires that circuit boards must not only be manufactured through non-hazardous processes but also designed for disassembly, sorting and safe recycling/disposal.

And the ELV states that, starting January 2007, automobiles designated for the European market must be designed with the same tasks in mind, with producers paying 'all or a significant part' of the costs of treating negative/nil-value vehicles at treatment facilities.

B41042A8686M_Datasheet PDF

Legally, these rules mean manufacturers must meet the costs of take-back and recycling of their own products. Economically and environmentally, those manufacturers who are smart about designing their products for ease of reclamation should actually reap financial benefits from doing so.

Other directives aimed at reducing energy consumption during both manufacturing and usage are in the early stages of adoption. The Energy Usage Products (EuP) policy imposes energy-use limits on a wide range of products, and even extends to components and sub-assemblies sold as spare parts. Compliance with EuP will be verified through the European CE Marking program alongside established safety and electromagnetic compatibility standards.

B41042A8686M_Datasheet PDF

Human nature believes it's easier to keep things as they are, even against persuasive arguments to the contrary. Often new products merely reflect a progression of incremental changes based on legacy designs and procedures.

Think how a car is assembled: although robotics has played a huge role in the past few decades, the overall assembly process still follows the structure laid down by Henry Ford. Worse yet, steps such as gluing and welding have replaced screwing or bolting in many areas, such that subassemblies cannot be opened for repair, but must be trashed and completely replaced.

Frequency-dependent RLGC matrix values are critical for modeling GHz loss effects due to skin effect (conductors) and loss tangent (dielectrics). Interconnects also possess dispersion at GHz frequencies, resulting in frequency-dependent propagation factors, which are also captured as RLGC frequency dependence. Such methods have allowed W-element models to align with measured data at frequencies as high as 40-110 GHz.

But the most impressive aspect of the W-element is its ability to provide fast and accurate time-domain simulations. Most tools that use frequency-domain models for time-domain simulation employ convolution calculations that are notoriously slow. The W-element, however, uses techniques that efficiently separate propagation, reflection, and loss factors, enabling fast recursive convolution while ensuring causality and passivity.

S-parameters fuel successful SI design

S-parameters, also called scattering parameters, have become the preferred method for characterizing passive components which are not well modeled by SPICE or transmission line methods. S-parameter data sets may originate from EM simulation, from direct vector network analyzer measurements, or from a linear circuit simulation of portions of an SI link. There is a definite trend towards encapsulating much of the off-chip design into a few large S-parameter data sets. In the case of IC package models, very large S-parameter data files may be involved. Efficient handling of such data has therefore become a priority for SI simulation.

The HSPICE S-element allows S-parameter data files to be used directly for simulation. Convolution calculations are performed automatically for time-domain simulation. Several options are available for handling S-parameter data in the most efficient ways possible. For large data files used to represent IC packages, HSPICE generates reduced order models (ROM) that can be efficiently analyzed with recursive convolution.

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