EDA Designline power series and is archived and updated. The root is accessible here. Please send me any updates, additions, references, white papers or other materials that should be associated with this posting. Thank you for making this a success – Brian Bailey.

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来源:LM317 Electronics Components编辑:Qoitech时间:2021-06-14 04:32:57

This posting is part of the EDA Designline power series and is archived and updated. The root is accessible here. Please send me any updates, additions, references, white papers or other materials that should be associated with this posting. Thank you for making this a success – Brian Bailey.

When only using passive cooling through air convection, the LEDs experienced uneven heating at temperatures much higher than 100°C. For this reason, the CeramCool Box was designed to allow coupling with an active water cooling system. A conventional chiller such as those used in PC technology is perfectly sufficient for heat dissipation. For handling simplicity, the designers limited the number of cooling water connections to a single inlet and outlet. The ceramic construction means the heat-sink can be used in aggressive environments and allows system developers to choose the coolant. Inside the ceramic heat-sink, four symmetrically arranged spiral condensers ensure even cooling all the way to the exterior. The interior ceramic walls are a mere one millimeter thick”, enabling the coolant to get closer to the heat source than any other concept, with a comparably long system lifetime. The Alunit (AIN) ceramic material exhibits a thermal conductivity greater than 170W/mK at room temperature, supporting superior heat spread even when designed with very thin walls. In conjunction with the sintering technology described above, this guarantees excellent heat transfer from the heat source to the coolant.

Thermal characterization using IR thermography and electrical junction temperature measurements proved the efficient and even temperature distribution. Thanks to the innovative interior design of the heat-sink, measurements showed temperature peaks of only 90°C with a coolant flow of 180l/h and an ambient and cooling water temperature of 30°C. For more precise measurement of the junction temperature, a special measuring apparatus was developed that can determine the temperature via the forward voltage within an accuracy of one degree Celsius.

csr bluetooth chip

About the author: . Rüdiger Herrmann is Key Account Manager in the Electronic Applications Division at CeramTec GmbH – www.ceramtec.de – He can be reached at

. Dr. Rafael Jordan is the Photonics Coordinator at the Fraunhofer IZM institute in Berlin – www.izm.fraunhofer.de – He can be reached at

This article originated from EE Times Europe magazine

csr bluetooth chip

Introduction Integrating audio IP that has been silicon proven and optimized for specific audio functions helps reduce power, area, and cost in today's multimedia system-on-chips (SoCs). As next-generation designs migrate to 28-nanometer (nm) process technologies however, new integration challenges arise. Audio functionality that exists in audio codecs consists mainly of analog circuitry, which does not scale with process technology, and therefore does not follow the traditional Moore's Law.

System architects and SoC designers need to take into consideration how the increased wafer pricing of 28-nm process technologies impacts the economics of incorporating audio codecs into advanced SoCs. Synopsys has performed testing on several mobile multimedia devices available in the market today, finding that most current models of smartphones and tablets can be supported with audio codecs developed in 28-nm.

csr bluetooth chip

This article presents the test results and discusses the business and technical challenges of integrating audio functionality into a 28-nm mobile multimedia SoC, while also offering insight on how to overcome those challenges. Some key design considerations are also explained, including scaling limitations, supply voltage requirements and system partitioning options.

Audio Codec Basics For clarity and the purpose of this discussion, an audio codec can be described using Figure 1 below. An audio codec contains microphone and line inputs, signal routing and mixing, amplifier blocks, and multiple ADC and DAC channels. It also consists of a variety of output drivers, including line outputs, headphone, and loudspeaker drivers as well as a small digital processing block consisting of decimating/interpolating filters and a standard I2S digital audio interface.

The hot-swap module is typically parallel stacked” onto the system motherboard in a mezzanine-style mother-daughter configuration. Power and signal connections are implemented using plated-through-hole (PTH) or surface-mount (SMT) terminals. Also note that the motherboard provides conductive thermal dissipation and heatsinking through the module’s terminal connections.

Nevertheless, with a double-sided module-board layout, the major power-dissipating components—the pass MOSFET and shunt resistor—are positioned on the top side of the module to purposely capitalize on whatever natural or forced convection is available in the application environment.

The relevant specifications of a hot-swap circuit module are called out in Table 1 .

 

 

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