设为首页 - 加入收藏
您的当前位置:首页 >Silego >680462-3_TE Connectivity_Crimpers, Applicators, Presses 正文

680462-3_TE Connectivity_Crimpers, Applicators, Presses

来源:LM317 Electronics Components编辑:Silego时间:2021-06-15 14:27:39

Simultaneously with the release of Sonar, Monterey will provide a Web-based version of the product, eSonar.

Okay, maybe that's exaggerating. But when the top bosses of multibillion-dollar companies start working the phones to secure scarce electronic components, it's time to expand manufacturing facilities.

680462-3_TE Connectivity_Crimpers, Applicators, Presses

The question, though, is how much capacity should be added? Indeed, too much might scuttle the current upturn. Visibility in almost every segment of the industry is no more than 60 to 90 days, so many industry players are adding as much capacity asthey feel will help them meet projected demand.

Capital is not a problem for many companies: It's easier to raise funds today than at any other time in the industry's history, according to analysts. Demand is also not a major concern. Consumers are shelling out oodles of money for the latest electronic gadgets.

Meanwhile, certain components used in the manufacture of the favored telecom gizmo barely make it to distributors' shelves before harried OEMs snatch them up. Semiconductor companies are responding by beefing up their capital expenditures to levels not seen since the mid-'90s, according to some estimates. Such investments helped torpedo the last industry upturn.

680462-3_TE Connectivity_Crimpers, Applicators, Presses

Only three years ago, it seemed chip makers were going to drown in overcapacity. With component prices adrift, suppliers regretted buckling under OEM pressure to add capacity as sales dropped precipitously and semiconductor-equipment manufacturers' book-to-bill ratios tilted below parity.

Fast forward to the first quarter of 2000. Y2K concerns turned out to be a total yawn, the surge in demand is buoying electronic-component prices, and many parts for hot telecom applications are on allocation-sending passive-component makers' revenue and profits into the stratosphere. Meanwhile, OEM purchasing managers can't knock any harder on suppliers' doors in an increasingly futile attempt to match demand with supply.

680462-3_TE Connectivity_Crimpers, Applicators, Presses

To prevent order backlogs from ballooning, the semiconductor world-including back-end and front-end component suppliers, foundries, chip-equipment makers, and chip makers' CEM and OEM customers-is steadily adding capacity.

Some investments are quite aggressive. At Taiwan Semiconductor Manufacturing Co. Ltd., for instance, engineers are cranking up fabs to squeeze any additional capacity from their operations even as TSMC management boosted the company's capital expenditure for fiscal 2000 to $4.7 billion, nearly double 1999's $2.5 billion.

But in the past couple of years expectations have been inflated by too much spotlight and attention on copper processing after IBM's big announcement in 1997. I don't think copper was so much over-hyped as it was misunderstood,” notes Dana Scranton, director of strategic marketing at Semitool Corp. in Kalispell, Mont., an early leader in supplying electrochemical deposition tools to do copper electroplating for metal lines and vias. We are now at the very early stages of implementing commercial devices and now seeing production orders.”

Many early copper users are now turning their attention to optimizing the metal in interconnect architectures in order to get the most out of low resistance and immunity from electrometal migration-something that can cause failures in thin wiring lines on ICs.

Originally, people were evaluating low-k processes first, but over the last two to two-and-a-half years they have concluded that copper is easier to implement,” says Tom Ritzdorf, director of technology for electrochemical deposition at Semitool. Optimization of copper will give you lower capacitance even if you do not use low-k dielectrics by making metal lines smaller and a little more room between them. We'll see that optimization of copper in designs happening as companies mature their processes.”

The move to copper has hit nearly all wafer fab tool suppliers in one way or another. Wafer furnaces, for example, are being installed in copper processing pilot lines for annealing steps. People have played with it the process steps, worked out the big bugs in manufacturing, and now they are starting to move it into manufacturing,” notes Aubrey Helms, vice president of technology at Silicon Valley Group Inc.'s thermal systems division.

Smooth sailing for now?

    1    2  3  4  5  6  7  8  9  10  11  
热门文章

    0.1756s , 9802.1640625 kb

    Copyright © 2016 Powered by 680462-3_TE Connectivity_Crimpers, Applicators, Presses,LM317 Electronics Components  

    sitemap

    Top